Description
Overview
Kingston's KSM32RS8/8HDR is a 1G x 72-bit (8GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/ parity, 1Rx8, ECC, memory module, based on nine 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
FEATURES
• Power Supply: VDD = 1.2V
• VDDQ = 1.2V
• VPP = 2.5V
• VDDSPD = 2.41V to 2.75V
• Functionality and operations comply with the DDR4 SDRAM/3DS SDRAM datasheet
• 16 internal banks
• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
• Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Supports ECC error correction and detection
• On-Die Termination (ODT)
• Temperature sensor with integrated SPD
• This product is in compliance with the RoHS directive.
• Per DRAM Addressability is supported
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• CA parity (Command/Address Parity) mode is supported
Specifications
Capacity
8GB
CL(IDD)
22 cycles
Row Cycle Time (tRCmin)
45.75ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin)
350ns(min.)
Row Active Time (tRASmin)
32ns(min.)
UL Rating
94 V - 0
Operating Temperature
0o C to +85o C
Storage Temperature
-55o C to +100o C
Kingston's KSM32RS8/8HDR is a 1G x 72-bit (8GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/ parity, 1Rx8, ECC, memory module, based on nine 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
FEATURES
• Power Supply: VDD = 1.2V
• VDDQ = 1.2V
• VPP = 2.5V
• VDDSPD = 2.41V to 2.75V
• Functionality and operations comply with the DDR4 SDRAM/3DS SDRAM datasheet
• 16 internal banks
• Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
• Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Supports ECC error correction and detection
• On-Die Termination (ODT)
• Temperature sensor with integrated SPD
• This product is in compliance with the RoHS directive.
• Per DRAM Addressability is supported
• Internal Vref DQ level generation is available
• Write CRC is supported at all speed grades
• CA parity (Command/Address Parity) mode is supported
Specifications
Capacity
8GB
CL(IDD)
22 cycles
Row Cycle Time (tRCmin)
45.75ns(min.)
Refresh to Active/Refresh Command Time (tRFCmin)
350ns(min.)
Row Active Time (tRASmin)
32ns(min.)
UL Rating
94 V - 0
Operating Temperature
0o C to +85o C
Storage Temperature
-55o C to +100o C